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Head Electronic co.,
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Head Electronic co.,ltd
Showing 1 - 7 of 7, total 1 pages [First] [Previous] [Next] [Last]
1
kraft paper
Specification: kraft paper
Detail: Technical specification: ITEM UNIT STANDARD CONDITION Quota g/m2 190¡À6 GB451.2-86 Thickness mm 0.28¡À0.03 GB451.3-89 Tensile strength KN/m Longitudinal¡Ý6.5 GB453-89 C...
2
1 layer alu. pcb
Specification: Layer: 1L
Detail: Layer: 1L Material: Aluminum Board thickness: 1.6mm Surface technique: ImmersionGold Minimum hole size: 0.6mm Application field: LED, Automobile mail to sales@headpcb.co for quotation
3
2 layer fpc
Specification: Layer: 2 layer
Detail: Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil ...
4
4 layer gold fingers pcb
Specification: Layer: 4L
Detail: Layer: 4L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.55mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u¡± min. Gold fingers/Au:10u¡± Solder mask: Red Silkscreen: white Profile: Routing + st...
5
6 layer i/g, impedance pcb
Specification: 6L pcb
Detail: Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u¡± min. Impedance control Profile: Routing E-test: 100% Fixture...
6
8 layer mobile pcb
Specification: Specification: 8L(1+6+1)
Detail: Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% ...
7
2 layer cem-3
Specification: 2L pcb
Detail: Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Qual...
Showing 1 - 7 of 7, total 1 pages [First] [Previous] [Next] [Last]
1
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